EPO-TEK® H31

About
EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesConductive,Thixotropic,Low odor,EMI,RFI
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Particle size< 45.0µm
Ionic type 
Cl-7ppm
K+41ppm
Na+143ppm
NH4+8ppm

Supplementary informationNominal valueUnitTest method
Degradation Temperature370TGA
Die Shear Strength(>5 kg,23℃)11.7MPa
working temperature 
Continuous-55 to 200
Intermittent-55 to 300
Storage Modulus(23℃)5.69GPa
Thixotropic index3.00 
Heating reduction
250℃0.060%

Uncured PropertiesNominal valueUnitTest method
colourSilver 
Density2.19g/cm³
viscosity
23℃15 to 25Pa·s
Curing time
150℃1.0hr
storage stability40000min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D84 
lap shear strength
23℃9.10MPa
Volume resistivity
23℃< 5.0E-4ohms·cm

THERMALNominal valueUnitTest method
4.8E-5cm/cm/℃
2.0E-4cm/cm/℃
Glass transition temperature> 110
Linear coefficient of thermal expansion
MD 
Thermal conductivity coefficient1.1W/m/K
Storage period
23℃13wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-250°C @ 20°C/Min
3. Below Tg
4. Above Tg
5. 5 rpm
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