EPO-TEK® OE184

About
A two component, high Tg, optically clear epoxy for packaging and assembly of fiber optics cables and components. It is suggested for termination of fibers into ferrules, or fabrication of waveguide devices. It is a faster curing alternative to EPO-TEK® 353ND. Complies with USP Class VI biocompatibility standards.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesBiocompatible
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
optical performanceNominal valueUnitTest method
Refractive index1.570 
Transmittance 
700-1400 nm> 95.0%
1550 nm95.0%

Supplementary informationNominal valueUnitTest method
Degradation Temperature474
Die Shear Strength(>10 kg,23℃)23.4MPa
working temperature 
Continuous-55 to 250
Intermittent-55 to 350
Storage Modulus(23℃)1.60GPa
Heating reduction 
200℃0.070%
250℃0.14%
300℃0.39%

Uncured PropertiesNominal valueUnitTest method
colour 
Amber 
Clear/Transparent 
Density 
Part B1.02g/cm³
Part A1.20g/cm³
viscosity
23℃3.0 to 4.0Pa·s
Curing time
150℃1.0hr
storage stability< 60min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D87 
lap shear strength
23℃11.3MPa
Relative permittivity
1 kHz3.45 
Volume resistivity
23℃> 7.0E+12ohms·cm
Dissipation factor
1 kHz7.0E-3 

THERMALNominal valueUnitTest method
3.6E-5cm/cm/℃
1.7E-4cm/cm/℃
Glass transition temperature> 100
Linear coefficient of thermal expansion
MD 
Thermosetting components 
Component A按重量计算的混合比: 10 
Component B按重量计算的混合比: 1.0 
Storage period
23℃52wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
3. Below Tg
4. Above Tg
5. 589 nm
6. Part B
7. Part A
8. 100 rpm
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