| About |
|---|
| FM® 2555 is a 350°F (177°C) cure, 440°F (227°C) post-cure modified cyanate ester film adhesive. This adhesive has good high temperature properties with low dielectric constant and low loss tangent electrical properties. Other products in this cyanate ester family include CYCOM® 5575-2 glass- and quartz- reinforced prepreg, FM® 2525 adhesive and FM® 6555-1 and BR® 6565 syntactic foams. Suggested Applications: Honeycomb sandwich construction Metal-to-metal bonding Composite-to-metal bonding Composite-to-composite bonding 350°F (177°C) cure satellite structure applications&& |
| Product Description | |
|---|---|
| Supplier | Cytec Industries |
| Generic | 胶黏剂 |
| Material Status | Commercial: Active |
| Features | High Heat Resistance,Good bond |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| THERMAL | Nominal value | Unit | Test method |
| Glass transition temperature | 232 | ℃ | |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Dielectric constant | |||
| 25 ℃，10.0 GHz | 2.80 |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| volatility | < 1.0 | % |
| Notes |
|---|
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