FM® 50

About
FM® 50 is a non-MDA-based polyimide foam material intended for core-splicing applications requiring 500 – 600°F (260 – 316°C) service. FM 50 may be cured in place with either a free or restrained foaming process. It contains no metallic fillers. Suggested Applications: High temperature core splice and edge sealing applications&&

Product Description
SupplierCytec Industries
GenericPI
Material StatusCommercial: Active
FeaturesHigh Heat Resistance,Heat Stabilized
AvailabilitysNorth America
Process MethodsFoam treatment

Technical Data
PHYSICALNominal valueUnitTest method
Density1.06g/cm³

MECHANICALNominal valueUnitTest method
shear strength
24℃0.655MPa

Cured PropertiesNominal valueUnitTest method
lap shear strength
24℃8.27MPa

Notes
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