| About |
|---|
| FM® 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with woven fiberglass carrier. FM 57 does not contain methylene dianiline (MDA). It is suitable for bonding metallic and non-metallic substrates as well as honeycomb structures. FM 57 film adhesive can be processed at 350°F (177°C) with a free-standing post-cure at 550°F (288°C). This adhesive film provides a service temperature of -67 to 550°F (-55 to 288°C) and can be used for repair and radar applications. Suggested Applications: Honeycomb sandwich construction Metallic bonding Non-metallic bonding&& |
| Product Description | |
|---|---|
| Supplier | Cytec Industries |
| Generic | PI |
| Material Status | Commercial: Active |
| Features | High Heat Resistance |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| MECHANICAL | Nominal value | Unit | Test method |
| tensile strength | |||
| 24℃ | 6.14 | MPa | |
| 177℃ | 4.59 | MPa | |
| shear strength | |||
| 24℃ | 24.8 | MPa | |
| 24℃ | 24.3 | MPa | |
| Notes |
|---|
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