ForTii® LDS51

About
30% Glass Reinforced, Flame Retardant, Halogen free and free of red phosphorous, Laser Direct Structuring (LDS) Special Features: Laser Direct Structuring Phosphorous free ForTii® is a breakthrough high temperature polyamide with halogen-free flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want €” and need. That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.

Product Description
SupplierDSM
GenericPA 4T
Material StatusCommercial: Active
FeaturesFlame Characteristics,Low to no phosphorus content
AvailabilitysAfrica & Middle East ,North America,Latin America,Asia Pacific,Europe
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.58g/cm³
Shrinkage rate
TD1.0%
MD0.30%

MECHANICALNominal valueUnitTest method
Tensile modulus11000MPa
tensile strength
fracture120MPa
Tensile strain
fracture1.6%

IMPACTNominal valueUnitTest method
Charpy Notched Impact Strength
23℃3.0kJ/m²
Charpy Unnotch Impact strength
23℃25kJ/m²

THERMALNominal valueUnitTest method
Hot deformation temperature
0.45 MPa, unannealed310
1.8 MPa, unannealed290
Glass transition temperature125
Melting temperature325
Linear coefficient of thermal expansion
MD3.0E-51/℃
TD4.0E-51/℃

Electrical performanceNominal valueUnitTest method
Volume resistivity> 1.0E+15ohms·cm
Relative permittivity
1.00 GHz4.05 
Compared to the leakage tracing index400V

FLAME CHARACTERISTICSNominal valueUnitTest method
Flammability level
0.8 mmV-0 

Process Conditions
injectionNominal valueUnitTest method
Drying temperature100°C
Drying time4.0 to 8.0hr
Barrel rear temperature320 to 330°C
Barrel middle temperature325 to 335°C
Barrel front temperature330 to 335°C
Nozzle temperature330 to 335°C
Processing (melt) temperature330 to 340°C
Mold temperature100 to 150°C
Injection speed中等偏快 
Back pressure0.500 to 3.00MPa
Screw compression ratio2.5:1.0 

Notes
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