ForTii® LDS81

About
35% Glass Reinforced, Laser Direct Structuring (LDS) Special Features: Contains release agent Laser Direct Structuring Used In: Smartphone frames ForTii® is a breakthrough high temperature polyamide with halogen-free flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want €” and need. That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.

About

35% Glass Reinforced, Laser Direct Structuring (LDS) Special Features: Contains release agent Laser Direct Structuring Used In: Smartphone frames ForTii® is a breakthrough high temperature polyamide with halogen-free flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries. We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want €” and need. That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.

Product Description
Supplier	DSM
Generic	PA 4T
Material Status	Commercial: Active
Availabilitys	Africa & Middle East ,North America,Latin America,Asia Pacific,Europe
Process Methods	Injection Molding

Technical Data
PHYSICAL	Nominal value	Unit	Test method
Density	1.57	g/cm³
Water absorption rate
Equilibrium, 23 ℃, 50% RH	1.7	%

MECHANICAL	Nominal value	Unit
Tensile modulus	12500	MPa
tensile strength
fracture	130	MPa
Tensile strain
fracture	1.2	%
Bending modulus	12000	MPa
bending strength	220	MPa

IMPACT	Nominal value	Unit	Test method
Charpy Notched Impact Strength
23℃	4.0	kJ/m²

THERMAL	Nominal value	Unit
Hot deformation temperature
0.45 MPa, unannealed	315	℃
1.8 MPa, unannealed	300	℃
Glass transition temperature	125	℃
Melting temperature	325	℃
Linear coefficient of thermal expansion
MD	2.5E-5	1/℃
TD	4.5E-5	1/℃

Electrical performance	Nominal value	Unit
Volume resistivity	> 1.0E+15	ohms·cm
Dielectric strength	26	kV/mm
Relative permittivity
1.00 GHz	4.00

FLAME CHARACTERISTICS	Nominal value	Unit	Test method
Flammability level
0.8 mm	HB

Process Conditions
injection	Nominal value	Unit	Test method
Drying temperature	100	°C
Drying time	2.0	hr
Barrel rear temperature	320 to 330	°C
Barrel middle temperature	325 to 335	°C
Barrel front temperature	330 to 335	°C
Nozzle temperature	330 to 335	°C
Processing (melt) temperature	330 to 340	°C
Mold temperature	100 to 150	°C
Injection speed	中等偏快
Back pressure	0.500 to 3.00	MPa
Screw compression ratio	2.5:1.0

Notes
【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.

Notes

【 Disclaimer 】
Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.