Fusabond® M623XF

About
Fusabond® M623XF resin is a random ethylene copolymer, incorporating a monomer which is classified as being a maleic anhydride equivalent for application uses. The exact composition is considered to be proprietary information. Applications: Fusabond® M623XF is used as a modifier to be included in hot melt formulations for enhancing the performance of hot melt adhesives. It is miscible with EVA and Ethylene acrylic ester copolymers: It is best used when incorporated in hot melt formulations of EVA or Ethylene acrylic ester copolymers for enhancing and expanding adhesion performance. Because of its high fluidity and higher melting point, it may also impart processing and handling benefits for hot melt formulations. Fusabond® M623XF can also be dispersed in latex form, or ground into powder form, for other process applications, and end uses. Applications include but are not limited to: Adhesives, Polymer Modification, Coupling agent, Powder coating&&

Product Description
SupplierDOW
GenericPE copolymerization
Material StatusCommercial: Active
AvailabilitysAfrica & Middle East ,North America,Latin America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Density0.940g/cm³ASTM D792
Density0.940g/cm³ISO 1183
Melt Flow Rate ASTM D1238
120℃,2.16kg60g/10minASTM D1238
190℃,2.16kg400g/10minASTM D1238
Melt Flow Rate ISO 1133
120℃,2.16kg60g/10minISO 1133
190℃,2.16kg400g/10minISO 1133

THERMALNominal valueUnitTest method
Melting temperature
DSC 
100ASTM D3418
100ISO 3146
Freezing point – DSC 
80ISO 3146
80ASTM D3418

Supplementary informationNominal valueUnitTest method
Processing temperature< 235

Notes
1. Typical properties: these are not to be construed as specifications.
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