About |
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CB0260-1 features excellent flow properties allowing it to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC level 2 (85°C/60% RH, 168 hours) preconditioning. A cavity or potting dam is required for flow control.&& |
Product Description | |
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Supplier | Henkel |
Generic | 环氧树脂 |
Material Status | Commercial: Active |
Features | High purity,High liquidity,Baking |
Availabilitys | Africa & Middle East ,North America,Latin America,Asia Pacific,Europe |
Technical Data | |||
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THERMAL | Nominal value | Unit | Test method |
Glass transition temperature | 149 | ℃ | |
Linear coefficient of thermal expansion | |||
MD | |||
40 to 120 ℃ | 1.8E-5 | cm/cm/℃ | |
190 to 220 ℃ | 6.7E-5 | cm/cm/℃ |
Electrical performance | Nominal value | Unit | Test method |
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Volume resistivity | 1.0E+16 | ohms·cm | IEC 60093 |
Dielectric constant | |||
25 ℃,1 kHz | 3.40 | IEC 60250 | |
Dissipation factor | |||
25℃,1 kHz | 0.010 | IEC 60250 |
Supplementary information | Nominal value | Unit | Test method |
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Extractable ion content | |||
Chloride:121℃ | 2 | ppm | |
Potassium:121℃ | 1 | ppm | |
Sodium:121℃ | 2 | ppm | |
-65 to 150 | ℃ |
Uncured Properties | Nominal value | Unit | Test method |
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Density | 1.80 | g/cm³ | |
viscosity | |||
Brookfield HBT, 25 ℃ | 40 | Pa·s | |
Curing time | |||
125℃ | 0.50 | hr | |
165℃ | 1.5 | hr | |
Gelation time | |||
121℃ | 9.0 | min | |
storage stability | |||
25 ℃ | 1400 | min | |
Storage period | |||
-40℃ | 6 | month |
MECHANICAL | Nominal value | Unit | Test method |
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Shore hardness | |||
Shaw’s D | 90 | ||
Bending modulus | |||
25℃ | 12300 | MPa | |
240℃ | 588 | MPa | |
bending strength | |||
25℃ | 142 | MPa | |
240℃ | 18.6 | MPa |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
2. Spindle 14, speed 50 rpm |
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