Hysol® CB0260-1

About
CB0260-1 features excellent flow properties allowing it to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC level 2 (85°C/60% RH, 168 hours) preconditioning. A cavity or potting dam is required for flow control.&&

Product Description
SupplierHenkel
Generic环氧树脂
Material StatusCommercial: Active
FeaturesHigh purity,High liquidity,Baking
AvailabilitysAfrica & Middle East ,North America,Latin America,Asia Pacific,Europe

Technical Data
THERMALNominal valueUnitTest method
Glass transition temperature149
Linear coefficient of thermal expansion
MD
40 to 120 ℃1.8E-5cm/cm/℃
190 to 220 ℃6.7E-5cm/cm/℃

Electrical performanceNominal valueUnitTest method
Volume resistivity1.0E+16ohms·cmIEC 60093
Dielectric constant
25 ℃,1 kHz3.40 IEC 60250
Dissipation factor
25℃,1 kHz0.010 IEC 60250

Supplementary informationNominal valueUnitTest method
Extractable ion content
Chloride:121℃2ppm
Potassium:121℃1ppm
Sodium:121℃2ppm
-65 to 150

Uncured PropertiesNominal valueUnitTest method
Density1.80g/cm³
viscosity
Brookfield HBT, 25 ℃40Pa·s
Curing time
125℃0.50hr
165℃1.5hr
Gelation time
121℃9.0min
storage stability
25 ℃1400min
Storage period
-40℃6month

MECHANICALNominal valueUnitTest method
Shore hardness
Shaw’s D90 
Bending modulus
25℃12300MPa
240℃588MPa
bending strength
25℃142MPa
240℃18.6MPa

Notes
1. Typical properties: these are not to be construed as specifications.
2. Spindle 14, speed 50 rpm
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