| About |
|---|
| GR869 is a green semiconductor grade molding compound especially designed for SOIC, TSOP and QFP packages with Ni/Pd and copper leadframes. It offers much improved JEDEC performance as well as moldability property. GR869 meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits Green product Low stress High adhesion Low moisture absorption Excellent solder reflow resistance High moldability&& |
| Product Description | |
|---|---|
| Supplier | Henkel |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Excellent Processability,Good bond,Baking,Low moisture absorption |
| Availabilitys | Africa & Middle East ,North America,Latin America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 1.96 | g/cm³ | |
| Spiral flow length | 109 | cm | |
| Water absorption rate | |||
| 85℃，7days，85% RH | 0.18 | % | |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Glass transition temperature | 100 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| < 100℃ | 9.0E-6 | cm/cm/℃ | |
| > 100℃ | 4.5E-5 | cm/cm/℃ | |
| Thermal conductivity coefficient | 0.80 | W/m/K |
| FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
|---|---|---|---|
| Flame retardant level | |||
| 3.20 mm | V-0 | UL 94 |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Gelation time | |||
| 175℃ | 0.47 | min | |
| Storage period | |||
| 5℃ | 6 | month |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D, 175 ℃ | 80 | ||
| Bending modulus | |||
| 25℃ | 18500 | MPa | |
| bending strength | |||
| 25℃ | 120 | MPa |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Melt Temperature: 347°F |
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