Keyflex® BT 2140D

About
Description Low Modulus Application Films & Sheets&&

Product Description
SupplierLG Chemical
GenericTPC-ET
Material StatusCommercial: Active
AvailabilitysNorth America,Latin America,Asia Pacific,Europe
Process MethodsExtrusion

Technical Data
PHYSICALNominal valueUnitTest method
Density1.14g/cm³ASTM D792
Melt Flow Rate
230℃,2.16kg5.0g/10minASTM D1238
Water absorption rate
23℃,24hr0.60%ASTM D570

MECHANICALNominal valueUnitTest method
Shore hardness ASTM D2240
Shore A, 23 ℃95 ASTM D2240
Shore D, 23 ℃, injection molding43 ASTM D2240
tensile strength
Fracture, 23 ℃, 2 mm, injection molding34.3MPaASTM D638
Tensile strain
Fracture, 23 ℃, 2 mm, injection molding1000%ASTM D638
Bending modulus
23 ℃, 6.40 mm, injection molding78.5MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch ASTM D256
-40 ℃, 6.4mm, injection moldingNo Break ASTM D256
23 ℃, 6.4mm, injection moldingNo Break ASTM D256

THERMALNominal valueUnitTest method
Hot deformation temperature
0.45 MPa, unannealed, 6.4 mm, injection molded70.0ASTM D648
Melting peak temperature198ASTM D3418

Process Conditions
ExtrusionNominal valueUnitTest method
Drying temperature80 to 90°C
Drying time3.0 to 4.0hr
Recommended maximum moisture content< 0.010%
Barrel 1 zone temperature200 to 220°C
Barrel 2 zone temperature210 to 230°C
Barrel 3 zone temperature210 to 230°C
Barrel 4 zone temperature210 to 230°C
Connector temperature210 to 230°C
Melt temperature200 to 240°C
Nozzle temperature200 to 220°C

Notes
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