Kimura® K23X - SOLIAO

About
A brown coloured high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for aggressive semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments. Kimura® K23X can be fully moulded into custom shapes and O-rings (from 6.07mm/0.24″ ID & 1.78mm/0.07″ CS up to 600mm/23.6″ ID & 10mm/0.39″ CS). Key Attributes Exceptionally pure – does not contain any fillers which may cause particulation problems. Low modulus ensures excellent sealing characteristics Outstanding plasma resistance – ideal for Chlorine, Fluorine & Oxygen chemistries. Exceptionally low plasma etch rate Low thermal expansion Retro-fits existing O-ring grooves (including FKM & FFKM grooves) Low permeation Low out-gassing Low adhesion (reduced sticking) Typical Applications Dynamic seals Static seals Wafer-handling products&&

About

A brown coloured high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for aggressive semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments. Kimura® K23X can be fully moulded into custom shapes and O-rings (from 6.07mm/0.24″ ID & 1.78mm/0.07″ CS up to 600mm/23.6″ ID & 10mm/0.39″ CS). Key Attributes Exceptionally pure – does not contain any fillers which may cause particulation problems. Low modulus ensures excellent sealing characteristics Outstanding plasma resistance – ideal for Chlorine, Fluorine & Oxygen chemistries. Exceptionally low plasma etch rate Low thermal expansion Retro-fits existing O-ring grooves (including FKM & FFKM grooves) Low permeation Low out-gassing Low adhesion (reduced sticking) Typical Applications Dynamic seals Static seals Wafer-handling products&&

Product Description
Generic	特殊弹性体
Material Status	Commercial: Active
Features	Low CLTE,High purity,Low odor
Availabilitys	North America,Asia Pacific,Europe

Technical Data
MECHANICAL	Nominal value	Unit	Test method
Shore hardness
Shaw’s A	70		ASTM D2240 , ISO 7619
IRHD hardness	70		ASTM D1415 , ISO 48

elastic body	Nominal value	Unit	Test method
tensile strength
yield	12.0	MPa	ASTM D412 , ISO 37
100% strain	6.70	MPa	ASTM D412 , ISO 37
Tensile strain
fracture	150	%	ASTM D412，ISO 37
Compression deformation
204℃，72 hr	25	%	ASTM D395，ISO 815

THERMAL	Nominal value	Unit	Test method
Maximum operating temperature	270	℃
Linear coefficient of thermal expansion	2.20E-4

Notes
1. Typical properties: these are not to be construed as specifications.
【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.

Notes

1. Typical properties: these are not to be construed as specifications.

【 Disclaimer 】
Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.