KumhoSunny PC/ABS HAC8260H

About
HAC8260H is high flow PC/ABS resin. HAC8260H has an excellent low temperature resistance properties. HAC8260H is mainly used in mobile phone housing,etc.&&

Product Description
SupplierKumhoSunny
GenericPC+ABS
Material StatusCommercial: Active
FeaturesHigh liquidity,Antifreeze,HB
AvailabilitysAsia Pacific
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.12g/cm³ASTM D792
Melt Flow Rate
230℃,10.0kg25g/10minASTM D1238
Shrinkage rate
MD0.50 to 0.70%ASTM D955

MECHANICALNominal valueUnitTest method
tensile strength56.0MPaASTM D638
Tensile strain
fracture100%ASTM D638
Bending modulus2100MPaASTM D790
bending strength80.0MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
3.2mm750J/mASTM D256

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed106ASTM D648
Vicat Softening Temp118ASTM D1525 2

Electrical performanceNominal valueUnitTest method
Surface resistivity> 1.0E+15ohmsIEC 60093
Volume resistivity> 1.0E+15ohms·cmIEC 60093

FLAME CHARACTERISTICSNominal valueUnitTest method
1.60 mmHB UL 94

Supplementary informationNominal valueUnitTest method
CSA File No.LS 66457 

Process Conditions
injectionNominal valueUnitTest method
Drying temperature100 to 110°C
Drying time4.0 to 6.0hr
Processing (melt) temperature240 to 280°C
Mold temperature60 to 90°C

Notes
1. Typical properties: these are not to be construed as specifications.
2. Rate B (120°C/h)
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