KumhoSunny PC HCG2510MP

About
HCG2510MP is high rigidity and high tenacity 10%GF PC resin. It has high stability and super shape resistance property. HCG2510MP is mainly used in mobile phone housing, etc.&&

Product Description
SupplierKumhoSunny
GenericPolycarbonate
Material StatusCommercial: Active
FeaturesGood Rigidity,Good stability
AvailabilitysAsia Pacific
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.25g/cm³ASTM D792
Melt Flow Rate
300℃,1.20kg20g/10minASTM D1238
Shrinkage rate
MD0.20 to 0.40%ASTM D955

MECHANICALNominal valueUnitTest method
tensile strength59.0MPaASTM D638
Tensile strain
fracture9.0%ASTM D638
Bending modulus3250MPaASTM D790
bending strength98.0MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
3.2mm140J/mASTM D256

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed135ASTM D648

Electrical performanceNominal valueUnitTest method
Surface resistivity> 1.0E+15ohmsIEC 60093
Volume resistivity> 1.0E+15ohms·cmIEC 60093

Process Conditions
injectionNominal valueUnitTest method
Drying temperature100 to 120°C
Drying time3.0 to 4.0hr
Recommended maximum moisture content0.020%
Barrel rear temperature250 to 270°C
Barrel middle temperature260 to 280°C
Barrel front temperature280 to 300°C
Nozzle temperature280 to 290°C
Processing (melt) temperature290 to 300°C
Mold temperature100 to 140°C
Back pressure0.300 to 1.00MPa
Screw speed20 to 100rpm

Notes
1. Typical properties: these are not to be construed as specifications.
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