LDS-PC/ABS 1101S

About

Product Description
GenericPC+ABS
Material StatusCommercial: Negative

Technical Data
PHYSICALNominal valueUnitTest method
Density1.18g/cm³ASTM D792
Melt index
300℃,1.2kg5g/10minISO 1133
Forming shrinkage rate0.4 – 0.6%ISO 294-4
Water absorption rate0.30%ASTM D570

MECHANICALNominal valueUnitTest method
tensile strength
50 mm/min45MPaISO 527-2
elongation at break
50 mm/min50%ISO 527-2
Tensile modulus
5 mm/min1800MPaISO 527-2
bending strength
2 mm/min70MPaISO 178
Bending modulus
2 mm/min2000MPaISO 178

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch400J/mASTM D256
Notched impact strength of cantilever beamNBJ/mASTM D256

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa100ISO 75-2
Vicat Softening Temp125ISO 306

Electrical performanceNominal valueUnitTest method
Dielectric constant
1 Hz4.70ASTM D150-11
100 Hz4.30ASTM D150-11
Dissipation factor
1 Hz9.5E-3ASTM D150-11
100 Hz5.0E-3ASTM D150-11
Volume resistivity1.0E+16ohm·cmIEC 60093

Process Conditions
InjectionNominal valueUnitTest method
drying temperature80 – 110
Drying time2 – 4hrs
Maximum moisture content0.05%
Melting temperature280 – 290
Hopper temperature50 – 80
A period of temperature260 – 270
Second stage temperature270 – 275
Three stage temperature270 – 280
Nozzle temperature270 – 285
Mold temperature50 – 80
Back pressure0.1 – 0.5MPa

Notes
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