LNP™ THERMOCOMP™ Compound UF0067V

About
LNP THERMOCOMP UF0067V is PPA base glass fiber filled compounds, good for LDS (Laser direct structuring) applications. Additional feature is high heat such that articles made of it can survive SMT process.

Product Description
SupplierSABIC
GenericPPA
Material StatusCommercial: Active
AvailabilitysAsia Pacific

Technical Data
PHYSICALNominal valueUnitTest method
Density1.45g/cm³ASTM D792
Shrinkage rate
MD0.30%
TD0.50%
Water absorption rate
23℃,24hr0.050%ISO 62

MECHANICALNominal valueUnitTest method
Tensile modulus9500MPaASTM D638
Tensile strength (fracture)104MPaASTM D638
Tensile strain
fracture1.6%ASTM D638
Bending modulus
3.20 mm8500MPaASTM D790
bending strength
Yield, 50 mm span150MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
23℃34J/mASTM D256
Notched impact strength of cantilever beam
23℃300J/mASTM D4812

THERMALNominal valueUnitTest method
Hot deformation temperature
0.45 MPa, unannealed, 3.2 mm276
1.8 MPa, unannealed, 3.2 mm255

Electrical performanceNominal valueUnitTest method
Dielectric constant
1.10 GHz3.56 Internal Method
Dissipation factor
1.1 GHz9.0E-3 Internal Method

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level
0.40 mmV-0 UL 94

Process Conditions
InjectionNominal valueUnitTest method
drying temperature120°C
Drying time4.0 to 7.0hr
Temperature at the rear of the barrel260 to 280°C
Temperature in the middle of the barrel280 to 300°C
Front temperature of material barrel300 to 320°C
Nozzle temperature300 to 320°C
Processing (melt) temperature290 to 330°C
Mold temperature120 to 150°C

Notes
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