LNP™ THERMOCOMP™ DX11354 compound

About
This is a PC compound with good plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications.&&

Product Description
SupplierSABIC
GenericPolycarbonate
Material StatusCommercial: Active
FeaturesGood surface appearance,Electroplating,HB
AvailabilitysAsia Pacific
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.27g/cm³ASTM D792
Melt Flow Rate
300℃,1.20kg12g/10minASTM D1238
Shrinkage rateASTM D955
MD:24 hrs0.60 to 0.65%
TD:24 hrs0.60 to 0.65%
Water absorption rate
24hr,50% RH0.010%ASTM D570

MECHANICALNominal valueUnitTest method
Tensile modulus2560MPaASTM D638
tensile strengthASTM D638
yield59.0MPa
fracture52.0MPa
Tensile strainASTM D638
yield5.7%
fracture64%
Bending modulus
50 mm span2300MPaASTM D790
bending strengthASTM D790
Yield, 50 mm span91.0MPa
Fracture, 50 mm span90.0MPa

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
23℃750J/mASTM D256

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed, 3.2 mm124ASTM D648
Linear coefficient of thermal expansionASTM E831
MD:-40~40℃6.3E-51/℃
TD:-40~40℃6.9E-51/℃

Electrical performanceNominal valueUnitTest method
Relative permittivity
1.00 GHz2.92IEC 60250
Dissipation factor
1 GHz7.0E-3IEC 60250

FLAME CHARACTERISTICSNominal valueUnitTest method
0.60 mmHBUL 94

Process Conditions
injectionNominal valueUnitTest method
Drying temperature100 to 110°C
Drying time3.0 to 4.0hr
Drying time, maximum8.0hr
Recommended maximum moisture content0.020%

Notes
1. Typical properties: these are not to be construed as specifications.
2. 2.0 in/min
3. Type I, 2.0 in/min
4. 0.051 in/min
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