About |
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LNP THERMOCOMP Compound DX11354X is a colorable PC based compound with stable plating and RF performance, colored LDS material solution, good surface and processing window, high impact strength. It is a general purpose product available in internal and external parts for Laser Direct Structuring applications.&& |
Product Description | |
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Supplier | SABIC |
Generic | Polycarbonate |
Material Status | Commercial: Active |
Features | Excellent Processability,Good surface appearance,High impact resistance,Electroplating |
Availabilitys | Asia Pacific |
Process Methods | Injection Molding |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Density | 1.28 | g/cm³ | ISO 1183 |
Melt Volume Rate | |||
300℃,1.2 kg | 20.0 | cm³/10min | ISO 1133 |
Shrinkage rate | ISO 294-4 | ||
TD:24 hrs | 0.50 to 0.70 | % | |
MD:24 hrs | 0.50 to 0.70 | % | |
Water absorption rate | |||
Equilibrium, 23 ℃, 50% RH | 0.050 | % | ISO 62 |
MECHANICAL | Nominal value | Unit | Test method |
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Tensile modulus | |||
— | 2400 | MPa | ASTM D638 |
— | 2320 | MPa | ISO 527-1-2 |
tensile strength | |||
yield | 55.0 | MPa | ASTM D638 |
yield | 54.0 | MPa | ISO 527-2/50 |
fracture | 45.0 | MPa | ASTM D638 |
fracture | 51.0 | MPa | ISO 527-2/50 |
Tensile strain | |||
yield | 5.0 | % | ASTM D638 |
yield | 5.0 | % | ISO 527-2/50 |
fracture | 70 | % | ASTM D638 |
fracture | 84 | % | ISO 527-2/50 |
Bending modulus | |||
50 mm span | 2380 | MPa | ASTM D790 |
— | 2450 | MPa | ISO 178 |
bending strength | |||
— | 86.0 | MPa | ISO 178 |
Yield, 50 mm span | 86.0 | MPa | ASTM D790 |
IMPACT | Nominal value | Unit | Test method |
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Impact strength of cantilever beam notch | |||
23℃ | 700 | J/m | ASTM D256 |
23℃ | 60 | kJ/m² | ISO 180-1A |
THERMAL | Nominal value | Unit | Test method |
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Hot deformation temperature | |||
1.8 MPa, unannealed, 3.2 mm | 121 | ℃ | ASTM D648 |
1.8 MPa, unannealed, 64 mm span | 117 | ℃ | ISO 75-2/Af |
Vicat Softening Temp | |||
B50 | 136 | ℃ | ISO 306/B50, ASTM D1525 12 |
Linear coefficient of thermal expansion | ASTM E831 | ||
MD:-40~40℃ | 6.5E-5 | 1/℃ | |
TD:-40~40℃ | 7.1E-5 | 1/℃ |
Electrical performance | Nominal value | Unit | Test method |
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Surface resistivity | 1.0E+16 | ohms | ASTM D257 |
Volume resistivity | 1.0E+16 | ohms·cm | ASTM D257 |
Dielectric constant | |||
1.00 GHz | 3.03 | ASTM D150 | |
Dissipation factor | |||
1 GHz | 6.6E-3 | ASTM D150 |
Process Conditions | |||
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injection | Nominal value | Unit | Test method |
Drying temperature | 110 to 120 | °C | |
Drying time | 2.0 to 4.0 | hr | |
Recommended maximum moisture content | 0.020 | % | |
Hopper temperature | 40.0 to 60.0 | °C | |
Barrel rear temperature | 245 to 265 | °C | |
Barrel middle temperature | 260 to 280 | °C | |
Barrel front temperature | 260 to 280 | °C | |
Nozzle temperature | 255 to 275 | °C | |
Processing (melt) temperature | 260 to 280 | °C | |
Mold temperature | 80.0 to 140 | °C |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
2. 2.0 in/min |
3. Type I, 2.0 in/min |
4. 0.051 in/min |
5. 0.079 in/min |
6. at Yield |
7. 80*10*3 mm |
8. 80*10*4 mm |
9. Rate A (50°C/h), Loading 1 (10 N) |
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