LNP™ THERMOCOMP™ DX11354X compound

About
LNP THERMOCOMP Compound DX11354X is a colorable PC based compound with stable plating and RF performance, colored LDS material solution, good surface and processing window, high impact strength. It is a general purpose product available in internal and external parts for Laser Direct Structuring applications.&&

Product Description
SupplierSABIC
GenericPolycarbonate
Material StatusCommercial: Active
FeaturesExcellent Processability,Good surface appearance,High impact resistance,Electroplating
AvailabilitysAsia Pacific
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.28g/cm³ISO 1183
Melt Volume Rate
300℃,1.2 kg20.0cm³/10minISO 1133
Shrinkage rateISO 294-4
TD:24 hrs0.50 to 0.70%
MD:24 hrs0.50 to 0.70%
Water absorption rate
Equilibrium, 23 ℃, 50% RH0.050%ISO 62

MECHANICALNominal valueUnitTest method
Tensile modulus
2400MPaASTM D638
2320MPaISO 527-1-2
tensile strength
yield55.0MPaASTM D638
yield54.0MPaISO 527-2/50
fracture45.0MPaASTM D638
fracture51.0MPaISO 527-2/50
Tensile strain
yield5.0%ASTM D638
yield5.0%ISO 527-2/50
fracture70%ASTM D638
fracture84%ISO 527-2/50
Bending modulus
50 mm span2380MPaASTM D790
2450MPaISO 178
bending strength
86.0MPaISO 178
Yield, 50 mm span86.0MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
23℃700J/mASTM D256
23℃60kJ/m²ISO 180-1A

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed, 3.2 mm121ASTM D648
1.8 MPa, unannealed, 64 mm span117ISO 75-2/Af
Vicat Softening Temp
B50136ISO 306/B50, ASTM D1525 12
Linear coefficient of thermal expansionASTM E831
MD:-40~40℃6.5E-51/℃
TD:-40~40℃7.1E-51/℃

Electrical performanceNominal valueUnitTest method
Surface resistivity1.0E+16ohmsASTM D257
Volume resistivity1.0E+16ohms·cmASTM D257
Dielectric constant
1.00 GHz3.03ASTM D150
Dissipation factor
1 GHz6.6E-3ASTM D150

Process Conditions
injectionNominal valueUnitTest method
Drying temperature110 to 120°C
Drying time2.0 to 4.0hr
Recommended maximum moisture content0.020%
Hopper temperature40.0 to 60.0°C
Barrel rear temperature245 to 265°C
Barrel middle temperature260 to 280°C
Barrel front temperature260 to 280°C
Nozzle temperature255 to 275°C
Processing (melt) temperature260 to 280°C
Mold temperature80.0 to 140°C

Notes
1. Typical properties: these are not to be construed as specifications.
2. 2.0 in/min
3. Type I, 2.0 in/min
4. 0.051 in/min
5. 0.079 in/min
6. at Yield
7. 80*10*3 mm
8. 80*10*4 mm
9. Rate A (50°C/h), Loading 1 (10 N)
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