LNP™ THERMOCOMP™ NX10302 compound

About
This is a PC/ABS compound with improved plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications.&&

Product Description
SupplierSABIC
GenericPC+ABS
Material StatusCommercial: Active
FeaturesElectroplating
AvailabilitysAsia Pacific
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.26g/cm³ASTM D792
Shrinkage rate
MD:3.2 mm0.60-0.65%ASTM D995
TD:3.2 mm0.50-0.56%ASTM D995
Water absorption rate
23℃,24hr0.010-0.020%ASTM D570

MECHANICALNominal valueUnitTest method
tensile strength
屈服,5mm/min,23°C46.0MPaASTM D638
23℃,5 mm/min47.0MPaASTM D638
Tensile strain
Yield, 23 ℃, 5 mm/min4.2%ASTM D638
Fracture, 5 mm/min, 23 ℃100%ASTM D638
Tensile modulus
23℃,50 mm/min2480MPaASTM D638
bending strength
Yield, 1.30 mm/min, 23 ℃80.0MPaASTM D790
1.30 mm/min,23℃79.0MPaASTM D790
Bending modulus
1.30 mm/min,23℃2400MPaASTM D790

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed108ASTM D648
Linear coefficient of thermal expansion
MD8.47E-51/℃ASTM D696
TD9.10E-51/℃ASTM D696

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
23℃600J/mASTM D256
Notched impact strength of cantilever beamNBASTM D4812

Notes
1. Typical properties: these are not to be construed as specifications.
2. 2.0 in/min
3. Type I, 0.20 in/min
4. 0.051 in/min
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