| About |
|---|
| LOCTITE EO7029 encapsulant is formulated for use in smart card applications. The thixotropic property of this material is designed to avoid flow during cure.&& |
| Product Description | |
|---|---|
| Supplier | Henkel |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Thixotropic,Baking,Fast Cure |
| Availabilitys | Africa & Middle East ,North America,Latin America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| MECHANICAL | Nominal value | Unit | Test method |
| Shore hardness | |||
| Shaw’s D | > 80 | DIN 53505 | |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Glass transition temperature | 110 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| 40 to 80 ℃ | 6.6E-5 | cm/cm/℃ | |
| 140 to 200 ℃ | 1.8E-4 | cm/cm/℃ |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Density | |||
| 25℃ | 1.20 | g/cm³ | |
| viscosity | |||
| Brookfield, 25 ℃ | 13 | Pa·s | |
| Brookfield, 25 ℃ | 48 | Pa·s | |
| Curing time | |||
| 150℃ | 0.083 | hr | |
| 120℃ | 1.0 | hr | |
| Gelation time | |||
| 110℃ | 7.0 | min | |
| 100℃ | 13 | min | |
| Storage period | |||
| -20℃ | 6 | month |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Spindle 6, speed 50 rpm |
| 3. Spindle 6, speed 5 rpm |
| 4. Robust non-stress sensitive components |
| 5. Stress sensitive components |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |