Lumax® HR5157

About
Description Heat Resistance Application E&E(CD ROM Tray)&&

Product Description
SupplierLG Chemical
GenericABS+PBT
Material StatusCommercial: Active
FeaturesHigh Heat Resistance,HB
AvailabilitysNorth America,Latin America,Asia Pacific,Europe
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.33g/cm³ASTM D792
Melt Flow Rate
250℃,2.16kg10g/10minASTM D1238
Shrinkage rate
MD0.40 to 0.90%ASTM D955
Water absorption rate
23℃,24hr0.080%ASTM D570

MECHANICALNominal valueUnitTest method
tensile strength
Fracture, 3.20 mm69.6MPaASTM D638
Tensile strain
Fracture, 3.20 mm3.0%ASTM D638
Bending modulus
3.20 mm4120MPaASTM D790
bending strength
Yield, 3.20 mm108MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
23℃,6.4mm64J/mASTM D256

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed, 6.4 mm175ASTM D648
Melting peak temperature223ASTM D3418
Relative temperature index
Electrical performance50.0UL 746
Strength mechanical performance50.0UL 746
Impact mechanical performance50.0UL 746

Electrical performanceNominal valueUnitTest method
Volume resistivity1.0E+15ohms·cmASTM D257
Dielectric strength
1 mm21kV/mmASTM D149
Arc resistancePLC 5 ASTM D495
Compared to the leakage tracing indexPLC 2 UL 746

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level UL 94
1.50 mmHB UL 94
3.00 mmHB UL 94

Process Conditions
injectionNominal valueUnitTest method
Drying temperature100°C
Drying time4.0 to 5.0hr
Recommended maximum moisture content0.020%
Barrel rear temperature225 to 235°C
Barrel middle temperature230 to 245°C
Barrel front temperature245 to 255°C
Nozzle temperature245 to 255°C
Processing (melt) temperature245 to 255°C
Mold temperature40 to 80°C

Notes
1. Typical properties: these are not to be construed as specifications.
2. 0.20 in/min
3. 0.051 in/min
4. Solution A
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