| About |
|---|
| Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability. Typical Applications Housings for power components. Encapsulation/housings for bobbins, actuators, and coils. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. LED lighting assemblies.&& |
| Product Description | |
|---|---|
| Generic | Polycarbonate |
| Material Status | Commercial: Active |
| Features | Excellent Processability,High Heat Resistance,Thermal conductivity |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 1.45 | g/cm³ | ASTM D792 |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Tensile modulus | |||
| 23℃ | 6900 | MPa | ASTM D638 |
| tensile strength | |||
| Fracture, 23 ℃ | 59.0 | MPa | ASTM D638 |
| Tensile strain | |||
| Fracture, 23 ℃ | 1.6 | % | ASTM D638 |
| Bending modulus | |||
| 23 ℃, 50 mm span | 8200 | MPa | ASTM D790 |
| bending strength | |||
| Fracture, 23 ℃, 50 mm span | 85.0 | MPa | ASTM D790 |
| IMPACT | Nominal value | Unit | Test method |
|---|---|---|---|
| Impact strength of cantilever beam notch | |||
| 23℃ | 32 | J/m | ASTM D256 |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Hot deformation temperature | |||
| 1.8 MPa, unannealed, 3.2 mm | 136 | ℃ | ASTM D648 |
| Thermal conductivity coefficient | |||
| 23℃ | 6.1 | W/m/K | ASTM C177 |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Surface resistivity | 8.0E+12 | ohms | ASTM D257 |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. 2.0 in/min |
| 3. 0.051 in/min |
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