About |
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Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PK DP110/X5 is a thermally conductive polyetheretherketone, offering excellent chemical resistance, good stiffness and high HDT. It should be used in demanding applications where thermal management must be accomplished in harsh environments. Typical Applications Housings for power components, such as motors, coils, and transformers. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. Critical military/aerospace applications involving severe environments.&& |
Product Description | |
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Generic | PEEK |
Material Status | Commercial: Active |
Features | Good Rigidity,Thermal conductivity,Solvent resistance |
Availabilitys | North America |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Density | 1.52 | g/cm³ | ASTM D792 |
MECHANICAL | Nominal value | Unit | Test method |
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Tensile modulus | 6250 | MPa | ASTM D638 |
tensile strength | |||
yield | 75.0 | MPa | ASTM D638 |
Tensile strain | |||
fracture | 2.5 | % | ASTM D638 |
Bending modulus | |||
50 mm span | 7050 | MPa | ASTM D790 |
bending strength | |||
Yield, 50 mm span | 135 | MPa | ASTM D790 |
IMPACT | Nominal value | Unit | Test method |
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Impact strength of cantilever beam notch | |||
23℃ | 33 | J/m | ASTM D256 |
THERMAL | Nominal value | Unit | Test method |
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Hot deformation temperature | |||
1.8 MPa, unannealed, 3.2 mm | 206 | ℃ | ASTM D648 |
Glass transition temperature | 150 | ℃ | DSC |
Thermal conductivity coefficient | 3.1 | W/m/K | ASTM C177 |
Electrical performance | Nominal value | Unit | Test method |
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Surface resistivity | 8.0E+12 | ohms | ASTM D257 |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
2. 2.0 in/min |
3. 0.051 in/min |
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