NEMCON H PK DP110/X5

About
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PK DP110/X5 is a thermally conductive polyetheretherketone, offering excellent chemical resistance, good stiffness and high HDT. It should be used in demanding applications where thermal management must be accomplished in harsh environments. Typical Applications Housings for power components, such as motors, coils, and transformers. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. Critical military/aerospace applications involving severe environments.&&

Product Description
GenericPEEK
Material StatusCommercial: Active
FeaturesGood Rigidity,Thermal conductivity,Solvent resistance
AvailabilitysNorth America

Technical Data
PHYSICALNominal valueUnitTest method
Density1.52g/cm³ASTM D792

MECHANICALNominal valueUnitTest method
Tensile modulus6250MPaASTM D638
tensile strength
yield75.0MPaASTM D638
Tensile strain
fracture2.5%ASTM D638
Bending modulus
50 mm span7050MPaASTM D790
bending strength
Yield, 50 mm span135MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
23℃33J/mASTM D256

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed, 3.2 mm206ASTM D648
Glass transition temperature150DSC
Thermal conductivity coefficient3.1W/m/KASTM C177

Electrical performanceNominal valueUnitTest method
Surface resistivity8.0E+12ohmsASTM D257

Notes
1. Typical properties: these are not to be construed as specifications.
2. 2.0 in/min
3. 0.051 in/min
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