About |
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As a low stress alternative for electronic packaging, NuSil Technology’s silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications. Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chemical and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Adhesives and Sealants Comments: Longer Work Time&& |
Product Description | |
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Supplier | NuSil |
Generic | 硅酮 |
Material Status | Commercial: Active |
Features | Low contractility,Corrosion Resistant,Low moisture absorption,Heat Stabilized |
Availabilitys | Africa & Middle East ,North America,Latin America,Asia Pacific,Europe |
Technical Data | |||
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THERMAL | Nominal value | Unit | Test method |
Thermosetting components | |||
Component A | 按重量计算的混合比: 1.0 | ||
Component B | 按重量计算的混合比: 1.0 |
Supplementary information | Nominal value | Unit | Test method |
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Cure System | Platinum | ||
working temperature | -65 to 240 | ℃ |
Uncured Properties | Nominal value | Unit | Test method |
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colour | Translucent | ||
Density | 1.10 | g/cm³ | |
viscosity | |||
— | 50 | Pa·s | |
— | 80 | Pa·s | |
Curing time | |||
100℃ | 1.0 | hr | |
storage stability | 180 | min |
Cured Properties | Nominal value | Unit | Test method |
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Shore hardness | |||
Shaw’s A | 30 | ||
tensile strength | 7.58 | MPa | |
Tensile strain | |||
fracture | 600 | % | |
tear strength | 14.0 | kN/m | |
Electrical strength | 35 | kV/mm |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
2. Part B |
3. Part A |
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