NuSil CV-2964 - SOLIAO

About
As a low stress alternative for electronic packaging, NuSil Technology’s silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications. Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chemical and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Thermal Interface Materials (TIMs) Comments: 1.03 W/m-K, No Boron Nitride&&

About

As a low stress alternative for electronic packaging, NuSil Technology’s silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications. Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chemical and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Thermal Interface Materials (TIMs) Comments: 1.03 W/m-K, No Boron Nitride&&

Product Description
Supplier	NuSil
Generic	硅酮
Material Status	Commercial: Active
Features	Low contractility,Corrosion Resistant,Thermal conductivity,Low moisture absorption,Heat Stabilized
Availabilitys	Africa & Middle East ,North America,Latin America,Asia Pacific,Europe

Technical Data
Supplementary information	Nominal value	Unit	Test method
Cure System	Platinum
working temperature	-65 to 250	℃

Uncured Properties	Nominal value	Unit
colour	White
Density	2.42	g/cm³
viscosity
—	36	Pa·s
—	37	Pa·s
Curing time
150℃	0.25	hr
storage stability	300	min

Cured Properties	Nominal value	Unit
Shore hardness
Shaw’s A	55
lap shear strength	0.758	MPa
tensile strength	0.862	MPa
Tensile strain
fracture	50	%
tear strength	4.38	kN/m

THERMAL	Nominal value	Unit	Test method
Linear coefficient of thermal expansion
MD	1.5E-4	1/℃
Thermal conductivity coefficient	1.0	W/m/K	ASTM E1530
Thermosetting components
Component A	按重量计算的混合比: 1.0
Component B	按重量计算的混合比: 1.0
Tack Free Time	10.0	hr

Notes
1. Typical properties: these are not to be construed as specifications.
2. Part B
3. Part A
4. Primed with SP-270
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