NuSil EPM-2411-2

About
As a low stress alternative for electronic packaging, NuSil Technology’s silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications. Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chemical and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Glob Tops Comments: Glob Top encapsulant. Shear Thinning Index 2.5&&

About

As a low stress alternative for electronic packaging, NuSil Technology’s silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications. Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chemical and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Glob Tops Comments: Glob Top encapsulant. Shear Thinning Index 2.5&&

Product Description
Supplier	NuSil
Generic	硅酮
Material Status	Commercial: Active
Features	Low contractility,Corrosion Resistant,Low moisture absorption,Heat Stabilized
Availabilitys	Africa & Middle East ,North America,Latin America,Asia Pacific,Europe

Technical Data
Electrical performance	Nominal value	Unit	Test method
Dielectric strength	16	kV/mm	ASTM D149

Supplementary information	Nominal value	Unit	Test method
Cure System	Platinum
working temperature	-65 to 250	℃

Uncured Properties	Nominal value	Unit
colour	Black
Density	1.16	g/cm³
viscosity	300	Pa·s
Curing time
200℃	0.25	hr
storage stability	> 480	min

Cured Properties	Nominal value	Unit
Shore hardness
Shaw’s A	17
tensile strength	5.17	MPa
Tensile strain
fracture	700	%
tear strength	9.63	kN/m

Notes
1. Typical properties: these are not to be construed as specifications.
【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.

Notes

1. Typical properties: these are not to be construed as specifications.

【 Disclaimer 】
Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.