OnForce™ LFT 5200-5001 FR Natural

About
PolyOne’s Long Fiber Thermoplastic (LFT) compounds are formulated for demanding applications which require high stiffness and good impact such as metal replacement or other structural applications. These products exhibit enhanced physical and mechanical properties versus standard short fiber products. Benefits of LFT compounds include improved impact strength, elastic modulus, and material strength across wide temperature ranges from subambient to highly elevated. Furthermore, LFT compounds have been shown to offer improved performance in the areas of creep and fatigue performance, improved dimensional stability, and exhibit an exceptional surface finish when compared to traditional highly filled short fiber products.&&

Product Description
SupplierPolyone
Generic聚烯烃,共挤薄膜用聚烯烃
Material StatusCommercial: Active
FeaturesV-0
AvailabilitysAfrica & Middle East ,North America,Latin America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Density1.50g/cm³ISO 1183
Shrinkage rate0.25%ISO 294-4

MECHANICALNominal valueUnitTest method
Tensile modulus14000MPaISO 527-2
tensile strength
fracture100MPaISO 527-2
Tensile strain
fracture1.5%ISO 527-2
Bending modulus10200MPaISO 178
bending strength150MPaISO 178

IMPACTNominal valueUnitTest method
Charpy Notched Impact Strength18kJ/m²ISO 179
Charpy Unnotch Impact strength30kJ/m²ISO 179
Drop hammer impact14.0JASTM D5420

THERMALNominal valueUnitTest method
Hot deformation temperature 
1.8 MPa, unannealed154ISO 75-2/A
8.0 MPa, unannealed140ISO 75-2/C

Flammability levelNominal valueUnitTest method
3.2 mmV-0 IEC 60695-11-10, -20
Glowing wire flammability index
1.6 mm960IEC 60695-2-12

Process Conditions
injectionNominal valueUnitTest method
Drying temperature80°C
Drying time2.0hr
Processing (melt) temperature210 to 230°C
Mold temperature60°C

Notes
1. Typical properties: these are not to be construed as specifications.
2. Measured on a tensile specimen. Actual mold shrinkage values are highly dependant on part geometry, mold configuration, and processing conditions.
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