Perlast® G74P

About
A translucent beige compound with semi-crystalline perfluoropolymer nano-filler, specially developed to meet the demands of the semiconductor and bio-analytical industries. Compatible with fluorine based chemistries and universally suitable for both wet and dry semiconductor processes including Lithography, Plasma, PVD, CVD, Etch, Stripping and Cleaning. Perlast® G74P combines a fully fluorinated polymer backbone, a fully fluorinated nano-filler system (no inorganic fillers) and a highly fluorinated cross-linking process, which results in a perfluoroelastomer with unrivalled purity, chemical resistance and mechanical properties. Perlast® G74P exhibits extremely low out-gassing properties, making it ideal for use in vacuum applications. Key Attributes Exceptionally pure – does not contain any inorganic fillers which may cause particulation problems. Excellent chemical and temperature resistance. Excellent mechanical properties. Extremely low out-gassing properties making it ideal for vacuum sealing applications. High material compliance reduces surface permeation. Reduced first wafer effect. Lower cost of ownership. Typical Applications Dynamic seals Static seals Wafer-handling products&&

Product Description
GenericPFE
Material StatusCommercial: Active
FeaturesHigh purity,High Heat Resistance,Low odor,Solvent resistance,Heat Stabilized
AvailabilitysNorth America,Asia Pacific,Europe

Technical Data
MECHANICALNominal valueUnitTest method
Shore hardness
Shaw’s A74 ASTM D2240
IRHD hardness70 to 80 ASTM D1415 , ISO 48

elastic bodyNominal valueUnitTest method
tensile strength
yield20.0MPaASTM D412 , ISO 37
100% strain5.80MPaASTM D412 , ISO 37
Tensile strain
fracture260%ASTM D412,ISO 37
Compression deformation ASTM D395 , ISO 815
200℃,24 hr24%ASTM D395,ISO 815
204℃,70 hr38%ASTM D395,ISO 815

THERMALNominal valueUnitTest method
Maximum operating temperature275
Linear coefficient of thermal expansion5.70E-4 

Notes
1. Typical properties: these are not to be construed as specifications.
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