Plaskon CMU-870-2C

About
This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON CMU Series is the total molded underfill solution for Flip Chip in Package.&&

About

This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON CMU Series is the total molded underfill solution for Flip Chip in Package.&&

Product Description
Generic	环氧树脂
Material Status	Commercial: Active
Features	Low warping,Excellent Processability,Conductive,V-0
Availabilitys	North America

Technical Data
PHYSICAL	Nominal value	Unit	Test method
Density	1.89	g/cm³	ASTM D792

MECHANICAL	Nominal value	Unit	Test method
Bending modulus			ASTM D790
22℃	1.42	MPa	ASTM D790
260℃	0.739	MPa	ASTM D790
bending strength			ASTM D790
22℃	0.00981	MPa	ASTM D790
260℃	0.00373	MPa	ASTM D790

THERMAL	Nominal value	Unit	Test method
Glass transition temperature	194	℃	ASTM E1356
Linear coefficient of thermal expansion
MD	1.3E-5	1/℃	ASTM D696
Thermal conductivity coefficient	0.70	W/m/K	ASTM C177

Electrical performance	Nominal value	Unit	Test method
Volume resistivity	4.5E+15	ohms·cm	ASTM D257
Dielectric strength	31	kV/mm	ASTM D149
Dielectric constant
1 kHz	3.13		ASTM D150
Dissipation factor
1 kHz	1.7E-3		ASTM D150

FLAME CHARACTERISTICS	Nominal value	Unit	Test method
Flame retardant level
3.20 mm	V-0		UL 94

Notes
1. Typical properties: these are not to be construed as specifications.
【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.

Notes

1. Typical properties: these are not to be construed as specifications.

【 Disclaimer 】
Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.