RTP 2599 X 113384 A

About
LDS Platable&&

Product Description
GenericPC+ABS
Material StatusCommercial: Negative
FeaturesElectroplating
AvailabilitysAfrica & Middle East ,North America,Latin America,Asia Pacific,Europe
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.28g/cm³ASTM D792
Shrinkage rate
MD:3.2 mm0.60 to 0.80%ASTM D955
water content0.020%

MECHANICALNominal valueUnitTest method
Tensile modulus2410MPaASTM D638
tensile strength49.6MPaASTM D638
Tensile strain
yield> 10%ASTM D638
Bending modulus2410MPaASTM D790
bending strength85.5MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
3.2mm590J/mASTM D256
Notched impact strength of cantilever beam
3.2 mm无断裂 ASTM D4812

Electrical performanceNominal valueUnitTest method
Dielectric constant
1 MHz3.00 ASTM D150
Dissipation factor
1 MHz0.015 ASTM D150

Process Conditions
injectionNominal valueUnitTest method
Drying temperature93°C
Drying time4.0hr
Dew Point-29°C
Processing (melt) temperature243 to 274°C
Mold temperature52 to 93°C
Injection pressure68.9 to 103MPa

Notes
1. Typical properties: these are not to be construed as specifications.
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