RTP 3499-3 X 91193 A

About
Encapsulation grade – High Dielectric Constant&&

Product Description
Generic液态聚合物
Material StatusCommercial: Negative
FeaturesV-0
AvailabilitysAfrica & Middle East ,North America,Latin America,Asia Pacific,Europe
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density2.04g/cm³ASTM D792
Shrinkage rate
MD:3.2 mm0.20 to 0.30%ASTM D955

MECHANICALNominal valueUnitTest method
Tensile modulus14500MPaASTM D638
tensile strength75.8MPaASTM D638
Tensile strain
yield0.80%ASTM D638
Bending modulus13800MPaASTM D790
bending strength110MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
3.2mm43J/mASTM D256
Notched impact strength of cantilever beam
3.2 mm160J/mASTM D4812

THERMALNominal valueUnitTest method
Hot deformation temperature ASTM D648
0.45 MPa, unannealed277ASTM D648
1.8 MPa, unannealed249ASTM D648

Electrical performanceNominal valueUnitTest method
Dielectric constant
1 MHz4.80 ASTM D150

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level
1.50 mmV-0 UL 94

Process Conditions
injectionNominal valueUnitTest method
Drying temperature149°C
Drying time8.0hr
Dew Point-29°C
Processing (melt) temperature332 to 366°C
Mold temperature66 to 121°C
Injection pressure82.7 to 124MPa

Notes
1. Typical properties: these are not to be construed as specifications.
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