| About |
|---|
| Thermal conductive material, 20% Glass Reinforced, Laser Markable&& |
| Product Description | |
|---|---|
| Supplier | DSM |
| Generic | PA 46 |
| Material Status | Commercial: Active |
| Features | Thermal conductivity,Laser engraving |
| Availabilitys | Africa & Middle East ,North America,Latin America,Asia Pacific,Europe |
| Process Methods | Injection Molding |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 1.55 | g/cm³ | |
| Shrinkage rate | |||
| TD | 0.60 | % | |
| MD | 0.25 | % | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Tensile modulus | 12500 | MPa | |
| tensile strength | |||
| fracture | 130 | MPa | |
| Tensile strain | |||
| fracture | 2.5 | % | |
| Bending modulus | 12000 | MPa |
| IMPACT | Nominal value | Unit | Test method |
|---|---|---|---|
| Charpy Notched Impact Strength | |||
| 23℃ | 9.0 | kJ/m² | |
| Charpy Unnotch Impact strength | |||
| 23℃ | 55 | kJ/m² |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Hot deformation temperature | |||
| 1.8 MPa, unannealed | 210 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | 2.0E-5 | 1/℃ | |
| TD | 9.0E-5 | 1/℃ | |
| Thermal conductivity coefficient | |||
| — | 0.90 | W/m/K | |
| — | 2.1 | W/m/K |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Through Plane |
| 3. In Plane |
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