TECACOMP® PEEK LDS black 3980

About
Main features developed for the LPKF-LDS® process Target Industries electrical engineering mechanical engineering medical technology

Product Description
SupplierEnsinger
GenericPEEK
Material StatusCommercial: Active
AvailabilitysEurope
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.70g/cm³
Apparent density0.90g/cm³ISO 60
Melt Flow Rate
380℃,10.0kg70g/10minISO 1133
Melt Volume Rate
380℃,5 kg34.0cm³/10minISO 1133
Shrinkage rate
TD0.48%
MD0.38%
Water absorption rate
Equilibrium, 23 ℃, 50% RH< 0.10%ISO 62

MECHANICALNominal valueUnitTest method
Tensile modulus11500MPaISO 527-2/50
tensile strength105MPaISO 527-2/50
Tensile strain
fracture2.0%ISO 527-2/50

IMPACTNominal valueUnitTest method
Charpy Unnotch Impact strength25kJ/m²ISO 179/1eU

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed218ISO 75-2/A
Glass transition temperature143DIN 53765
Melting temperature343DIN 53765
Linear coefficient of thermal expansion
MD:23~100℃1.5E-51/℃
MD:200~260℃5.0E-51/℃
MD:260~300℃6.7E-51/℃
TD:23~100℃2.5E-51/℃
TD:200~260℃7.2E-51/℃
TD:260~300℃9.5E-51/℃
Operating temperature
long-term260
short-term300

Electrical performanceNominal valueUnitTest method
Surface resistivity5.8E+12ohmsDIN EN 61340
Volume resistivity5.8E+13ohms·cmDIN EN 61340
Dielectric strength18kV/mmIEC 60243-1
Compared to the leakage tracing index< 250VIEC 60112

FLAME CHARACTERISTICSNominal valueUnitTest method
Flammability levelV-0 IEC 60695-11-10, -20

Supplementary informationNominal valueUnitTest method
Adhesive strength
metal path19.4MPa
Lazer Marking
Forward movement1.8 to 2.4m/sec
Frequency120 to 180kHz
Power2.00 to 8.00Watts

Process Conditions
injectionNominal valueUnitTest method
Drying temperature140 to 160°C
Drying time4.0 to 6.0hr
Recommended maximum moisture content0.020%
Processing (melt) temperature360 to 400°C
Mold temperature160 to 210°C

Notes
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