About |
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Main features developed for the LPKF-LDS® process Target Industries electrical engineering mechanical engineering medical technology |
Product Description | |
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Supplier | Ensinger |
Generic | PEEK |
Material Status | Commercial: Active |
Availabilitys | Europe |
Process Methods | Injection Molding |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Density | 1.70 | g/cm³ | |
Apparent density | 0.90 | g/cm³ | ISO 60 |
Melt Flow Rate | |||
380℃,10.0kg | 70 | g/10min | ISO 1133 |
Melt Volume Rate | |||
380℃,5 kg | 34.0 | cm³/10min | ISO 1133 |
Shrinkage rate | |||
TD | 0.48 | % | |
MD | 0.38 | % | |
Water absorption rate | |||
Equilibrium, 23 ℃, 50% RH | < 0.10 | % | ISO 62 |
MECHANICAL | Nominal value | Unit | Test method |
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Tensile modulus | 11500 | MPa | ISO 527-2/50 |
tensile strength | 105 | MPa | ISO 527-2/50 |
Tensile strain | |||
fracture | 2.0 | % | ISO 527-2/50 |
IMPACT | Nominal value | Unit | Test method |
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Charpy Unnotch Impact strength | 25 | kJ/m² | ISO 179/1eU |
THERMAL | Nominal value | Unit | Test method |
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Hot deformation temperature | |||
1.8 MPa, unannealed | 218 | ℃ | ISO 75-2/A |
Glass transition temperature | 143 | ℃ | DIN 53765 |
Melting temperature | 343 | ℃ | DIN 53765 |
Linear coefficient of thermal expansion | |||
MD:23~100℃ | 1.5E-5 | 1/℃ | |
MD:200~260℃ | 5.0E-5 | 1/℃ | |
MD:260~300℃ | 6.7E-5 | 1/℃ | |
TD:23~100℃ | 2.5E-5 | 1/℃ | |
TD:200~260℃ | 7.2E-5 | 1/℃ | |
TD:260~300℃ | 9.5E-5 | 1/℃ | |
Operating temperature | |||
long-term | 260 | ℃ | |
short-term | 300 | ℃ |
Electrical performance | Nominal value | Unit | Test method |
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Surface resistivity | 5.8E+12 | ohms | DIN EN 61340 |
Volume resistivity | 5.8E+13 | ohms·cm | DIN EN 61340 |
Dielectric strength | 18 | kV/mm | IEC 60243-1 |
Compared to the leakage tracing index | < 250 | V | IEC 60112 |
FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
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Flammability level | V-0 | IEC 60695-11-10, -20 |
Supplementary information | Nominal value | Unit | Test method |
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Adhesive strength | |||
metal path | 19.4 | MPa | |
Lazer Marking | |||
Forward movement | 1.8 to 2.4 | m/sec | |
Frequency | 120 to 180 | kHz | |
Power | 2.00 to 8.00 | Watts |
Process Conditions | |||
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injection | Nominal value | Unit | Test method |
Drying temperature | 140 to 160 | °C | |
Drying time | 4.0 to 6.0 | hr | |
Recommended maximum moisture content | 0.020 | % | |
Processing (melt) temperature | 360 to 400 | °C | |
Mold temperature | 160 to 210 | °C |
Notes |
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