| About |
|---|
| Main features developed for the LPKF-LDS® process high thermal conductivity Target Industries automotive industry electrical engineering LED lighting technology mechanical engineering&& |
| Product Description | |
|---|---|
| Supplier | Ensinger |
| Generic | PPA |
| Material Status | Commercial: Active |
| Features | Thermal conductivity |
| Availabilitys | Europe |
| Process Methods | Injection Molding |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 1.96 | g/cm³ | |
| Melt Flow Rate | |||
| 300℃，5.0kg | 16 | g/10min | ISO 1133 |
| Melt Volume Rate | |||
| 300℃，5 kg | 8.40 | cm³/10min | ISO 1133 |
| Shrinkage rate | |||
| TD | 1.1 | % | |
| MD | 1.0 | % | |
| Water absorption rate | |||
| Equilibrium, 23 ℃, 50% RH | < 0.10 | % | ISO 62 |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Tensile modulus | 8750 | MPa | ISO 527-2/50 |
| tensile strength | 95.0 | MPa | ISO 527-2/50 |
| Tensile strain | |||
| fracture | 1.7 | % | ISO 527-2/50 |
| IMPACT | Nominal value | Unit | Test method |
|---|---|---|---|
| Charpy Unnotch Impact strength | 30 | kJ/m² | ISO 179/1eU |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Hot deformation temperature | |||
| 1.8 MPa, unannealed | 203 | ℃ | ISO 75-2/A |
| Glass transition temperature | 100 to 140 | ℃ | DIN 53765 |
| Melting temperature | 285 to 315 | ℃ | DIN 53765 |
| Linear coefficient of thermal expansion | |||
| MD：50~100℃ | 3.8E-5 | 1/℃ | |
| MD：100~150℃ | 5.3E-5 | 1/℃ | |
| MD：150~200℃ | 8.5E-5 | 1/℃ | |
| TD：50~100℃ | 4.9E-5 | 1/℃ | |
| TD：100~150℃ | 7.2E-5 | 1/℃ | |
| TD：150~200℃ | 9.3E-5 | 1/℃ | |
| specific heat | 860 | J/kg/℃ | DIN EN 821 |
| Thermal conductivity coefficient | |||
| — | 0.80 | W/m/K | |
| — | 1.0 | W/m/K | |
| Operating temperature | |||
| long-term | 150 | ℃ | |
| short-term | 250 | ℃ | |
| Thermal diffusion coefficient | |||
| In-plane | 0.560 | cSt | |
| Through-plane | 0.440 | cSt |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Surface resistivity | 5.0E+12 | ohms | DIN EN 61340 |
| Volume resistivity | 4.7E+13 | ohms·cm | DIN EN 61340 |
| Compared to the leakage tracing index | 600 | V | IEC 60112 |
| FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
|---|---|---|---|
| Flammability level | HB | IEC 60695-11-10, -20 |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Adhesive strength | |||
| metal path | 28.2 | MPa | |
| Lazer Marking | |||
| Forward moving | 2.0 to 3.0 | m/sec | |
| Frequency | 100 to 200 | kHz | |
| Power | 2.00 to 6.00 | Watts |
| Process Conditions | |||
|---|---|---|---|
| injection | Nominal value | Unit | Test method |
| Drying temperature | 100 | °C | |
| Drying time | 2.0 to 3.0 | hr | |
| Recommended maximum moisture content | 0.10 | % | |
| Processing (melt) temperature | 320 to 340 | °C | |
| Mold temperature | 150 to 170 | °C | |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Through-plane |
| 3. In-plane |
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