TROGAMID® T T5004

About
TROGAMID® T and BX consist of terephthalic acid and 2,2,4- /2,4,4-trimethyl hexamethylene diamine, a chemical composition that is responsible for their amorphous structure. This makes TROGAMID® T transparent in contrast to the semi-crystalline high-performance plastics of High Performance Polymers. The amorphous structure also results in low molding shrinkage and low tendency to warp. In addition to the basic products, a range of specially equipped compounds is also available. The product line fits a wide range of applications and satisfies many requirement profiles. TROGAMID® T5004 Permanently transparent polyamide with UV stabilizer and improved outdoor weathering behavior for injection molding, extrusion, and blow molding.&&

Product Description
SupplierEvonik
GenericPA 6/3T
Material StatusCommercial: Active
FeaturesWeather resistance is good,Low warping,High Viscosity,Good Electrical Properties,Low contractility,Copolymer,Solvent resistance,Heat Stabilized,Amorphous,V-2
AvailabilitysNorth America,Europe
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.12g/cm³ISO 1183
Viscosity number125cm³/gISO 307

IMPACTNominal valueUnitTest method
Charpy Notched Impact Strength ISO 179/1eA
-30 ℃, completely fractured6.0kJ/m²ISO 179/1eA
0 ℃, completely fractured9.0kJ/m²ISO 179/1eA
23 ℃, completely fractured10kJ/m²ISO 179/1eA
Charpy Unnotch Impact strength ISO 179/1eU
-30℃No Break ISO 179/1eU
0℃No Break ISO 179/1eU
23℃No Break ISO 179/1eU

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed130ISO 75-2/A
0.45 MPa, unannealed145ISO 75-2/B
Glass transition temperature150ISO 11357-2
Vicat Softening Temp 
155ISO 306/A
150ISO 306/B
Linear coefficient of thermal expansion
TD:23~80℃5.5E-51/℃ISO 11359-2
MD:23~80℃5.5E-51/℃ISO 11359-2

Electrical performanceNominal valueUnitTest method
Surface resistivity1.0E+13ohmsIEC 60093
Volume resistivity1.0E+15ohms·cmIEC 60093
Dielectric strength24kV/mmIEC 60243-1
Relative permittivity IEC 60250
23℃,50 Hz4.20 IEC 60250
23℃,1 MHz3.30 IEC 60250
23℃,100 MHz4.60 IEC 60250
Dissipation factor IEC 60250
23℃,50 Hz0.017 IEC 60250
23℃,1 MHz0.028 IEC 60250
23℃,100 MHz0.024 IEC 60250
Compared to the leakage tracing index IEC 60112
CTI575VIEC 60112
Solution A600VIEC 60112

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level UL 94
0.80 mmV-2 UL 94
1.60 mmV-2 UL 94
Glowing wire flammability index
1.0 mm800IEC 60695-2-12
Igniting temperature of the hot wire
1 mm875IEC 60695-2-13

MECHANICALNominal valueUnitTest method
Shore hardness
Shaw’s D86 ISO 868
Tensile modulus2800MPaISO 527-2
tensile strength
yield90.0MPaISO 527-2/50
Tensile strain
yield8.0%ISO 527-2/50
Nominal tensile fracture strain> 50%ISO 527-2/50
Tensile Creep Modulus(1 hr)2500MPaISO 899-1
Tensile creep modulus
1000 hr1300MPaISO 899-1
Bending modulus3000MPaISO 178
Ball hardness150MPaISO 2039-1

Notes
【 Disclaimer 】
Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.