About Designers use L-705 to create laminates capable of withstanding ballistic threats. L-705 is available in a variety of fabric styles to match the engineering requirements for a particular application. The cure cycle for L-705 allows easy processing in a…
About Jam PE 60535是一种高密度聚乙烯产品,。 它可以通过注射成型进行加工,在非洲和中东有供货。 典型应用领域为:工程/工业配件。 主要特性为:均聚物。&& Product Description Supplier Cytec Industries Generic 胶黏剂 Material Status Commercial: Active Features Weight distribution,Homopolymer Availabilitys Africa & Middle East Process Methods Injection Molding Technical Data Supplementary information Nominal value Unit Test method volatility…
About FM® 209-1 is a next generation film adhesive specially formulated for out-of-autoclave bonding of both metallic and composite structures. This new adhesive provides similar performance in vacuum-only versus autoclave cure and has a unique combination of toughness and shear…
About FM® 2555 is a 350°F (177°C) cure, 440°F (227°C) post-cure modified cyanate ester film adhesive. This adhesive has good high temperature properties with low dielectric constant and low loss tangent electrical properties. Other products in this cyanate ester family…
About CORFIL® 625-1 potting compound is a one-part, low density material formulated for use in insert and edge filling of honeycomb core. It may also be used as a syntactic core splice adhesive. It is formulated to have low viscosity…
About FM® 6555-1 is a cyanate ester syntactic core material. It was designed as a cost and weight saving alternative in the manufacture of thin, stiffness critical composite panels for low dielectric applications and satellite structures. FM 6555-1 syntactic core…
About CORFIL® 615 potting compound is a low density compound for use as insert or edge filling material in honeycomb sandwich construction. After the curing agent is added, CORFIL 615 remains a thick paste which will not run of its…
About FM® 309-1 a next generation adhesive film for bonding composite and metallic structures. This new film provides a unique combination of high Tg [182°C (360°F)], high toughness and higher temperature shear properties. FM 309-1 is designed for co-cure, co-bond…